HC 08 BLE CORE Bluetooth Module
Data transmission module based on Bluetooth Specification V4.0 BLE Bluetooth protocol. It integrates stamp packaging holes and pin header soldering holes, which can be used for SMD packaging and solder headers, which is very convenient to be embedded in the application system. Support broadcast mode, custom UUID.
Electrical characteristics:
- Module size: 26.9mm x 13mm
- Working frequency: 2.4G
- Communication Interface: UART
- Operating Voltage: 2.0V ~ 3.6V
- RSSI support: not support
- Communication level: 3.3V TTL
- Transmit power: 4dBm (maximum)
- Reference distance: 80m
- Air speed: 1Mbps
- Antenna interface: Built-in PCB antenna
- Sleep current: 0.4μA
- Receiving sensitivity: -93dBm@1Mbps
- Working humidity: 10% ~ 90%
- Storage temperature: -40℃ ~ +85℃
- Operating temperature: -25℃ ~ +75℃