HC 08 BLE CORE Bluetooth Module


Data transmission module based on Bluetooth Specification V4.0 BLE Bluetooth protocol. It integrates stamp packaging holes and pin header soldering holes, which can be used for SMD packaging and solder headers, which is very convenient to be embedded in the application system. Support broadcast mode, custom UUID.

Electrical characteristics:

  1. Module size: 26.9mm x 13mm
  2. Working frequency: 2.4G
  3. Communication Interface: UART
  4. Operating Voltage: 2.0V ~ 3.6V
  5. RSSI support: not support
  6. Communication level: 3.3V TTL
  7. Transmit power: 4dBm (maximum)
  8. Reference distance: 80m
  9. Air speed: 1Mbps
  10. Antenna interface: Built-in PCB antenna
  11. Sleep current: 0.4μA
  12. Receiving sensitivity: -93dBm@1Mbps
  13. Working humidity: 10% ~ 90%
  14. Storage temperature: -40℃ ~ +85℃
  15. Operating temperature: -25℃ ~ +75℃

Price :  excl. GST
Qty Price
1 > 294.15
6 > 273.14
21 > 252.13
50 > 241.63
100 > 239.53
200 > 235.32
500 > 231.12

Description - HC-08 Bluetooth module

HC-08 is a Bluetooth 4.0 low energy module, it can easily connect to iOS 5 and Android 4.3 or above by using a serial terminal app. It is a new generation of Bluetooth specification V4.0 BLE Bluetooth protocol based on the transmission module.
The HC-08 Bluetooth 4.0BLE Serial Port Module uses BLE (Bluetooth Low Energy) protocol. The main difference between Bluetooth and BLE is power consumption. Bluetooth consumes more power than BLE but can handle a lot of data. BLE is more appropriate for quickly transferring small amounts of data between nearby devices. BLE is less power-hungry, so the devices running this protocol can operate for years with a small battery; perfect for IoT!
HC-08 is a Bluetooth 4.0 low energy module, it can easily connect to iOS 5 and Android 4.3 or above by using a serial terminal app. You can use the Bluetooth communication up to 87 yards (80 meters) with this Bluetooth BLE module. It also runs on a 2.4GHz frequency. The chipset is CC2540 with 256K Byte space. You can change the role and serial baud rate and it supports AT commands for configuration.
Data transmission module based on Bluetooth Specification V4.0 BLE Bluetooth protocol. It integrates stamp packaging holes and pin header soldering holes, which can be used for SMD packaging and solder headers, which is very convenient to be embedded in the application system. Support broadcast mode, custom UUID.
HC-08 is a relatively new module made by an experienced Bluetooth design and manufacturing supplier in China. Its mass produced and therefore well-tested. It can be incorporated into products or projects without worrying about being able to get it again. It’s already widely used in many Bluetooth projects. 
Master-slave module, integrated with passthrough, remote control, PIO collected three functions, through the AT instruction set to switch and set up, and before using the bluetooth serial port module, without change of PCB and the application of singlechip processor system, easily upgrade to the bluetooth 4.0! Ultra low standby power consumption 90uA~400uA Vast connection distance of 100 feet / 60 meters Super fast reaction rate of 0.4 seconds Android, apple, PC, MAC all compatible To send and receive no byte limit, up to 3 k Bytes per second Use CC2541 chip Support IOS6 and Android 4.3 system Support standard BLE protocol Support UARE, the I2C interface Support bluetooth class1 and class2 mode Built-in PCB antenna Input Voltage: 3V Features: 1x HC-08 Bluetooth 4.0 Module.
 

 

Electrical characteristics:

  1. Module size: 26.9mm x 13mm
  2. Working frequency: 2.4G
  3. Communication Interface: UART
  4. Operating Voltage: 2.0V ~ 3.6V
  5. RSSI support: not support
  6. Communication level: 3.3V TTL
  7. Transmit power: 4dBm (maximum)
  8. Reference distance: 80m
  9. Air speed: 1Mbps
  10. Antenna interface: Built-in PCB antenna
  11. Sleep current: 0.4μA
  12. Receiving sensitivity: -93dBm@1Mbps
  13. Working humidity: 10% ~ 90%
  14. Storage temperature: -40℃ ~ +85℃
  15. Operating temperature: -25℃ ~ +75℃